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MASS LAM
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Our MASS LAM manufacturing plant located in Hsinchu, Taiwan is in the heart of local PCB manufacturers, systematic organizational planning and provide professional and complete customized services, to provide high quality and cost competitive product for customers.
Designated in accordance to service customer customization; mainly the process and equipment are described below:
＊Multi layer lamination production: over 10 million square feet per month
＊Main production: Cutting→Printing→AOI/Testing→Lamination
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MASS LAM
| Items | Capability | |
| 1 | Minimum Line Width/Line spacing (Work) |
3mil / 3mil |
|
2 |
Maximum finish board size (Automatic) |
680 X 800 mm |
|
3 |
Minimum finish board size (Automatic) |
305 X 355mm |
|
4 |
Maximum board thickness (Single) |
93 mil 1/1 |
|
5 |
Minimum board thickness (Single) |
2 mil H/H |
|
6 |
Range of inner layer copper thickness |
0.3 ~ 5 oz |
|
7 |
Range of outter layer copper thickness |
0.3 ~ 3 oz 和 5 oz |
|
8 |
Layers to Layers Registration |
3 mil |
|
9 |
Minimum/Maximum Layer |
4~16 Layers |
|
10 |
Board Hardness Tolerance |
0.7％ Per Inch |
|
11 |
Minimum Impedance Control |
± 5 Ω |
|
12 |
Total thickness after pressing |
8~132 mil |
CCL-UL Certification No：E206580